HIT-RE 10 Epoxy anchor Adhesive

Short Description:

HIT-RE 10 is an economical injectable epoxy adhesive anchor under Hilti. It is designed for anchoring in concrete, serving as a cost-effective alternative to nearly all grouted fasteners, minimizing adhesive waste. Stored in 580ml rigid containers, it works seamlessly with Hilti’s HDE 500 cordless electric dispenser for easy on-site application.

Compatible with Hilti’s full range of accessories (e.g., rechargeable electric adhesive guns, wire brushes, pistons), it offers extended adjustment time for flexible installation across scenarios. Suitable for non-cracked concrete (dry or wet substrates), it excludes seismic and fatigue loads.

Storage/transport temperature ranges from 5-25°C, while in-service temperature spans -40-55°C. Free of styrene and quality-certified, it’s ideal for building reinforcement, curtain wall installation, steel structure connection, and heavy equipment fixation.

Package: 580ml

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Product Detail

Product Tags

Applications

--Substitution of misplaced/missing rebar
--Connection of secondary post-installed rebar (e.g. staircases, upstands)
--Renovation/upgrading of post-installed rebar
--Rebar dowelling
--Anchoring non-structural secondary steel elements (e.g. columns, beams)

Technical data

Working time and curing time

Temperature of the base material TBM	Maximum working time twork	Initial curing time tcure,ini a)	Minimum curing time tcure a)
5。C ≤ TBM ≤ 10。C	5 h	30 h	72 h
10。C < TBM ≤ 15。C	2,5 h	20 h	48 h
15。C < TBM ≤ 20。C	2 h	15 h	36 h
20。C < TBM ≤ 30。C	60 min	10 h	24 h
30。C < TBM ≤ 40。C	30 min	5 h	12 h

Durability of Hilti-RE 10 injection mortar:

Condition	Comment	Resistance
Sulphurous atmosphere	23°C	+
High alkalinity	pH = 13,2, 23°C	+

Corrosion resistance of post-installed rebar:

Post-installed rebar connections made with Hilti-RE 10 injection mortar provide the same corrosion resistance as a cast-in-place rebar.

Installation temperature range:

+10°C to +40°C

Service temperature range

Hilti HIT-RE 10 injection mortar may be applied in the temperature ranges given below. An elevated base material temperature may lead to a reduction of the design bond resistance.